SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor module and a manufacturing method thereof. According to the embodiment of the present invention, this invention includes: a module substrate which mounts at least one electronic device; at least one external connection terminal combined with the module substrate; and a case combined with a first case and a second case. The first case and the second case respectively receive the module substrate on both sides of the module substrate and can be combined with each other.