| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin molding material capable of forming a cured body having excellent heat resistance and fire resistance, excellent in electrical insulation properties at high temperatures, and further excellent in adhesiveness to metals at high temperatures.SOLUTION: A thermosetting resin molding material contains an epoxy resin having 2 or more epoxy groups, a cyanate resin having 2 or more cyanate groups (-OCN) and a benzophenone derivative having a phenolic hydroxyl group. |
