| 摘要 |
<p>THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER (4), COMPRISING THE PROCESSING STEPS OF: A) HEATING ENCAPSULATING MATERIAL (9,51), B) DISPLACING THE ENCAPSULATING MATERIAL (9,51) TO A MOULD CAVITY (5,28,38,41), C) FILLING THE MOULD CAVITY (5,28,38,41), AND D) CURING THE ENCAPSULATING MATERIAL (9,51) IN THE MOULD CAVITY (5,28,38,41). THE INVENTION ALSO RELATES TO A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER (4). THE MOST SUITABLE</p> |
