| 摘要 |
A stack package of the present technique relates to a stack package which has the wire connection of a token ring loop structure. The stack package comprises a substrate which has a first and a second bond finger, semiconductor chips which have input bonding pads and output bonding pads and are stacked on the substrate, a first connection line which connects the first bond finger to the input bonding pad of the semiconductor chip which is arranged in the lowermost part, a second connection line which connects the output bonding pad of the semiconductor chip which is arranged at a lower part to the input bonding pad of the semiconductor chip which is arranged at an upper part, and a third connection line which connects the output bonding pad of the semiconductor chip which is arranged in the uppermost part to the second bond finger. |
