ORGANIC SOLDERABILITY PRESERVATIVE AND METHOD

摘要

The present invention relates to an organic solderability preservative (OSP) for coating surfaces of copper and copper alloy, and a method for the same. More specifically, the present invention relates to an organic solderability preservative for coating the surfaces of copper and copper alloy and a method for the same. The organic solderability preservative includes a pyrazine derivative. The organic solderability preservative and the method according to the present invention are capable of forming a continuous and substantially uniform organic film on a copper substrate and a copper alloy substrate. The film has excellent anti-corrosion and heat stability properties, and after multiple heating cycles, the solderability on the surfaces of copper and copper aluminum can still be maintained. The composition can also be used as a pre-dipping agent coated on copper or copper alloy before being coated with more than one type of a traditional OSP composition. The pre-dipping agent is capable of enhancing a final protective coating on the copper or copper alloy.