| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated plate which can suppress warpage, hardly causes cracks, and is excellent in handleability, and to provide a printed wiring board, and a method for manufacturing the laminated plate.SOLUTION: In a laminated plate including one or more cured resin layers and one or more glass substrate layers, a shear adhesive strength between the cured resin layer and the glass substrate layer at 25°C is 20 MPa or more. A printed wiring board having a wiring circuit provided on the surface of the laminated plate, and a method for manufacturing the laminated plate are provided. |
