| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits decrease in output of the semiconductor device as a whole even when a semiconductor element is broken.SOLUTION: A semiconductor device 1 which includes a plurality of semiconductor elements 2A, 2B and outputs respective outputs of the plurality of semiconductor elements 2A, 2B as one output comprises a plurality of wafer surface structures 11A, 11B corresponding to the plurality of semiconductor elements 2A, 2B on one chip 10. Each of the wafer surface structures 11A, 11B has a gate and an emitter, and to which gate wiring and output wiring are connected. The plurality of wafer surface structures 11A, 11B have structures to be arranged adjacent to each other. In the case where any semiconductor element is broken, since a region of these broken semiconductor element can be utilized fro heat radiation when another semiconductor element is driven, the other semiconductor element can be driven with an increased output.</p> |
