| 摘要 |
PROBLEM TO BE SOLVED: To relatively easily administrate a Sn alloy plating solution, and further, to simplify an apparatus.SOLUTION: A Sn alloy plating apparatus includes: an anion exchange membrane 54 which partitions the inside of a plating tank 16 into a cathode chamber 12 holding a Sn alloy plating solution Q in its inside and having a substrate W arranged in a state of being immersed in the Sn alloy plating solution and an anode chamber 14 holding an anolyte E containing Sn ions and an acid for forming a complex with divalent Sn ions in its inside and having a Sn anode 32 arranged in a state of being immersed in the anolyte; and an electrolytic solution supply line 24 for supplying an electrolytic solution containing the acid into the anode chamber. The electrolytic solution is supplied into the anode chamber through the electrolytic solution supply line so that the concentration of Sn ions of the anolyte in the anode chamber is a predetermined value or higher and that the concentration of the acid is prevented from becoming lower than a permissible value, and an increased amount of the anolyte according to the supply of the electrolytic solution in the anode chamber is supplied to the Sn alloy plating solution. |
