| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive film which has high conductivity and excellent adhesion to a substrate, and which suppresses generation of curl, and a precursor film with which the conductive film can be formed, as well as a method for producing the conductive film.SOLUTION: In a precursor film which is provided on a substrate 16 and is used for forming a conductive film containing metallic copper, the precursor film has copper oxide particles 11 and an inactive resin 12 which is free from any polymerization reaction or any crosslinking reaction caused by light or heat. In the total thickness from the surface side of the precursor film to the substrate 16 side, the content of the copper oxide particles 11, existing in the upper region from the surface side of the precursor film to a position corresponding to one third of the total thickness in the direction to the substrate 16 side, is more than the content of the copper oxide particles 11, existing in the lower region from the substrate 16 side to a position corresponding to one third of the total thickness in the direction to the surface side of the precursor film, and the content of the inactive resin existing in the upper region 13 is less than the content of the inactive resin existing in the lower region 15.</p> |
