| 摘要 |
An apparatus for treating a wafer-shaped article includes a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an upper surface of the rotary chuck. A ring is mounted on the rotary chuck, and includes a first upper surface overlapping an outer peripheral edge of the wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of the first surface. The second upper surface is elevated relative to the first upper surface to define an annular gap between the second upper surface and the wafer-shaped article when positioned on the spin chuck that is smaller than a distance between the first upper surface and the wafer-shaped article when positioned on the rotary chuck. |
