LAMINATED PLATE, MULTILAYER LAMINATED PLATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING LAMINATED PLATE

摘要

PROBLEM TO BE SOLVED: To provide a laminated plate which can form a fine circuit and is suitable for a semiconductor package and a printed wiring board, and to provide a printed wiring board, and a method for manufacturing the laminated plate.SOLUTION: In a laminated plate including one or more cured resin layers and one or more glass substrate layers, a surface roughness (Ra) of the cured resin layer is in a range of 0.1-0.5 μm. A printed wiring board having a wiring circuit provided on the surface of the laminated plate, and a method for manufacturing the laminated plate are provided.