| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip heat radiation structure which effectively lowers the operation temperature of an electronic product.SOLUTION: A chip heat radiation structure is used in an electronic product including a first chip having a first chip surface and a first chip rear surface and includes: a chip mold sealing material which covers at least a side edge of the first chip; a first case which is positioned above the first chip and contacts with the first chip rear surface of the first chip; a package substrate which is connected with the first chip surface of the first chip through multiple first bumps; and a circuit board which has a first surface and a second surface and is connected with the package substrate on the first surface through multiple pieces of solder. The chip heat radiation structure may further include a second case which is positioned below the circuit board and contacts with the second surface of the circuit board. Heat energy occurring in the first chip is conducted to the first case through the first chip rear surface and is conducted to the second case through the first chip surface, the first bumps, the package substrate, the solder, and the circuit board. |
