| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection method for scribing lines of a wafer and an inspection fixture therefor.SOLUTION: The inspection method includes following steps, a wafer to be inspected is provided, a light transmission carrier is coupled and scribing lines 12 are inspected. The method includes; first providing the wafer to be inspected including a plurality of dies 11; forming the scribing lines 12 between the dies 11; adhering a wafer dicing tape 20 on a bottom face 13 of the wafer to be inspected; adhering the wafer dicing tape 20 to the light transmission carrier 50 in which a first liquid medium 40 is installed and adhering the dicing tape 20 with the first liquid medium 40 in such a manner that a difference of refraction factors between the first liquid medium 40 and the wafer dicing tape 20 does not exceed 0.3; and finally aligning an inspection lens of an optical inspection device from the bottom face 13 of the wafer to be inspected to the scribing lines 12 via inspection of the light transmission carrier 50.</p> |
