发明名称 THERMAL INSULATION PLATE-SUPPORTING STRUCTURE, AND METHOD FOR ASSEMBLING BUFFER MATERIAL CONSTRUCTING THERMAL INSULATION PLATE-SUPPORTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To achieve a structure that can be inexpensively manufactured by restricting the number of components.SOLUTION: A periphery of an attachment hole 2a of a thermal insulation plate 1a is directly held between both holding portions 14a, 14b of a buffer material 7a. In addition, a sleeve 6a is arranged between the buffer material 7a and a connecting member 3a. Then, a diametral clearance 19 is arranged between an inner peripheral surface of a buffer material side cylindrical portion 13 of the buffer material 7a and an outer peripheral surface of a sleeve side cylinder portion 16 of the sleeve 6a. In addition, axial clearances 20a, 20b are arranged among the axial side surfaces of both holding portions 14a, 14b of the buffer material 7a and the axial side surfaces of the sleeve side flanges 17a, 17b of the sleeve 6a opposing against these both axial side surfaces.
申请公布号 JP2014118822(A) 申请公布日期 2014.06.30
申请号 JP20120271924 申请日期 2012.12.13
申请人 NIPPON REINZ CO LTD 发明人 MIZUKAMI TAKAHISA
分类号 F01N13/14;F02B39/00;F02B39/16;F02B77/11;F16F15/02;F16F15/06 主分类号 F01N13/14
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