发明名称 |
METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed wiring board exhibiting excellent adhesion of an insulation film and a copper foil after a gold plating step.SOLUTION: A method of manufacturing a flexible printed wiring board where an insulation film is laminated on a copper foil includes a gold plating step and a heat treatment step following the gold plating step. The breaking strength (E) before the gold plating step of the insulation film, and the breaking strength (E) after the heat treatment step following the gold plating step satisfy a relation; (E)/(E)>0.70. |
申请公布号 |
JP2014120578(A) |
申请公布日期 |
2014.06.30 |
申请号 |
JP20120273865 |
申请日期 |
2012.12.14 |
申请人 |
KANEKA CORP |
发明人 |
OGISO TETSUYA;SEKITO YOSHIHIDE |
分类号 |
H05K3/28;C08F2/44;C08F2/46;C08G59/18;G03F7/004;G03F7/027 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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