LAMINATED WIRING BOARD, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminated wiring board which can form a fine conductor pattern on a conductor layer, secures conduction between the conductor layers and has high connection reliability, and has a via hole that is filled with the conductor, and to provide a method for manufacturing the same.SOLUTION: A laminated wiring board includes: an insulating resin layer 11; a via land 12 formed on one surface of the insulating resin layer 11: an insulating resin layer 13 formed on one surface of the insulating resin layer 11 and a first surface of the via land 12; a first conductor which is filled in a via hole formed on the insulating resin layer 13 on the first surface of the via land 12; and a second conductor which is filled in a via hole formed on the insulating resin layer 11 on a second surface facing the first surface of the via land 12. The first conductor is electrically connected to the second conductor through the via land 12.