| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition containing a bis(meth)acryloyl-terminated benzyl ether compound having high level dielectric property (low dielectric constant and low dielectric dissipation factor) and providing a cured article having high glass transfer temperature and fire resistance.SOLUTION: A curable resin composition contains (A) a bis (meth)acryloyl-terminated benzyl ether compound having (meth)acryloyl groups at both terminals obtained by reacting an aromatic bis halomethyl compound having a fluorene skeleton of which both terminals are halomethylated, and a (meth)acrylic compound such as (meth)acrylic acid and potassium (meth)acrylate, and (B) a polymerization initiator. |
