| 摘要 |
PROBLEM TO BE SOLVED: To provide a test device applied to a test of a high-density wafer level fine pitch without a probe card and capable of satisfying a requirement of contact resistance in an electric test without damaging an electric test point and an electric connection point, and a test method for the test device.SOLUTION: A test device comprises: a frame 100 allowed to be aligned with a chip 200 having at least one of electric connection points 300 on the surface; a multilayer substrate 500 fixed in the flame; and at least one of electric test points 600 formed on the upper surface of the multilayer substrate corresponding to the at least one of electric connection points and for contacting with the at least one of electric connection points to perform an electric test to the chip. The at least one of electric connection points or electric test points may be a bump, and the surface of the at least one of electric connection points and the surface of the at least one of electric test points are formed and covered by inert metal or noble metal. |
