| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method capable of reducing occurrence of failures of semiconductor element.SOLUTION: A first electrode pad 21 on a first semiconductor element 2 is subjected to ball bonding. A second electrode pad 31 on a second semiconductor element 3 is stitch bonded onto a bump 13. Since a capillary 10 is not pressed directly to the first electrode pad 21 nor the second electrode pad 31, occurrence of failures in the first semiconductor element 2 and second semiconductor element 3 can be reduced. |
