| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve a problem of a fine connecting line caused by the deformation of a microelectronic apparatus due to high temperature, in the case of a conductive film package connection employing thermal curing.SOLUTION: An anisotropic conductive film includes a base film 106 and microcapsule structures set on the base film, and each of the microcapsule structures includes a metallic conductive particle 103, a normal-temperature curable macromolecular polymer 105 coated on the outside of the metallic conductive particle and a microcapsule wall 102 coated on the outside of the macromolecular polymer, and an adhesive colloid is adhered to an external surface of the microcapsule wall. As the metallic conductive particle and the normal-temperature curable macromolecular polymer are used as core materials and each of the microcapsule structures are used as a wall material, the microcapsule structure is destroyed by pressurization in use, the metallic conductive particle and the normal-temperature curable macromolecular polymer contained inside the wall material leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that conductive connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive film.</p> |
