| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of suppressing deterioration in transmission performance of a signal even when a plurality of semiconductor devices are mounted while being stacked on a substrate.SOLUTION: In a semiconductor module, a semiconductor device 50 is mounted on a mounting surface of a printed board. The semiconductor device has a plurality of chip side connection terminals 5 exposed to a second surface 1b side. A plurality of semiconductor devices 50 are mounted on the mounting surface of the printed board while making the second surface 1b face. The plurality of chip side connection terminals 5 are formed so as to be arranged parallel to a boundary side. A plurality of enable terminals are included in the chip side connection terminal 5. The enable terminals are arranged in a central part of the formed and arranged chip side connection terminal 5. A chip enable terminal, a write enable terminal, and an output enable terminal are included in the enable terminals.</p> |
