| 摘要 |
Provided is an apparatus for cooling a heated high-temperature material obtained by heating a target, such as a board (thick plate, thick material), to be cooled. The cooling apparatus includes a header for cooling a material; at least a pair of pinch rolls provided on a material transferred under the header to remove remaining water by sucking the remaining water between the rolls; and a transfer roll provided to support the transferred material and to spray the remaining water sucked into the pinch rolls. As described above, according to the present invention, the pinch roll performs a conventional function, and particularly performs a cooling function of sucking the remaining water between the rolls and spraying the remaining water to the bottom surface of the material through the transfer roll. Therefore, a cooling variation of the material resulting from the direct removal of the remaining water between the pinch rolls can be removed, and the sucked remaining water can be sprayed into the bottom surface of the material having lower cooling efficiency as compared with that of the top surface of the material. Accordingly, a cooling ability can be improved, thereby improving the cooling efficiency of the device, preventing the material from being deformed, and improving quality, which have improved effects. |
