| 摘要 |
FIELD: radio engineering, communication.SUBSTANCE: invention relates to a chip carrier (15) for contacting with a chip (16) and an antenna (13), lying on a carrier substrate (17). According to the invention, the chip carrier a strip-shaped substrate (18), which is equipped with a system (29) of contacts for electrical contact with the chip, the system being separated from longitudinal ends (25, 26) of the substrate, and two contact pads (27, 28) connected to the antenna, between which said system of contacts for electrical contact with the chip is situated and which are designed for electrical contact with the antenna, wherein the system of contacts for electrical contact with the chip and contact pads connected to the antenna are situated on the working surface (31) of the chip carrier on which, between the system of contacts for electrical contact with the chip and the contact pads connected to the antenna, there is at least one insulation surface (20). Also described is a chip carrier system which consists of a plurality of chip carriers situated on a film-type carrier, a row in at least one row passing in its longitudinal direction and each of which is oriented in the longitudinal direction of the film-type carrier.EFFECT: providing minimal thickness of a layered structure consisting of an antenna carrier substrate and a chip carrier.5 cl, 8 dwg |
