| 摘要 |
A simple structure which improves reliability of connection and secures creeping and spatial distances for electrical insulation without increasing manufacturing cost is provided. Feed-through terminals whose diameters can be reduced are bonded to lands of a wiring substrate, and insertion terminals are bonded to core wires of lead wires. The insertion terminals of the lead wires are arranged in the feed-through terminals bonded to the lands. In a state where the feed-through terminals are swaged and the insertion terminals of the lead wires are pressure-bonded, the insertion terminals of the lead wires are bonded to the feed-through terminals. |
