WAFER WETTING APPARTUS AND METHOD AFTER CHEMICAL MECHANICAL POLISHING RPOCESS

摘要

The present invention relates to a device and a method for wetting a wafer after a chemical mechanical polishing process. The wetting device for removing foreign materials while maintaining the process surface of a wafer finishing a chemical mechanical polishing process in a wet state comprises a water tank for receiving deionized water; a deionized water inlet introducing the deionized water into the water tank through the bottom surface of the water tank and inclined outward from the center part of the water tank to introduce the deionized water into the water tank; and a deionized water outlet formed on the outer edge of the water tank. The present invention can remove the foreign materials from the processed surface and can maintain the processed surface in the wet state by flowing the deionized water introduced from the deionized water inlet until the deionized water is discharged to the deionized water outlet positioned in the edge of the water tank in a state where the processed surface of the wafer is in contact with the deionized water flowing in the water tank.