| 摘要 |
FIELD: physics, optics.SUBSTANCE: invention can be used to emit light using light-emitting diodes (LED). The LED apparatus includes a metal substrate having a reflective surface, and a plurality of LED chips mounted directly to the reflective surface of the metal substrate to allow for heat dissipation, wherein at least some of the LED chips are spaced apart from each other to allow reflection of light from a portion of the reflective surface which is located between portions of the LED chips, as well as an electrical circuit formed by connecting LED chips to each other.EFFECT: high light efficiency, improved heat removal from the array of LED chips and easier manufacture of the array of LED chips.32 cl, 5 dwg |
