| 摘要 |
The present invention provides a wafer surface inspection device for reducing the detection time by expanding detection area on the surface of a wafer. To achieve the mentioned above, the device for inspecting the surface of the wafer comprises: a stage device for moving the wafer in a horizontal direction (x-axis) and a vertical direction (y-axis); an image obtaining device installed right above the wafer, and composed of a camera; and a pair of line lasers formed in both sides above the wafer. The pair of line lasers is arranged symmetrically to a line (z-axis) formed right above the center of the wafer and is inclined so that the surface of the wafer can be investigated with two laser beams in an overlapped state. The present invention can obtain a vivid image without an expensive high-resolution camera used to obtain the surface image of the wafer by generating overlapped scattered light using the line lasers. Besides, the present invention can reduce the inspection time by reducing the time for obtaining the entire surface image of the wafer using the linear laser beams. [Reference numerals] (AA) Wafer |
