| 摘要 |
The present invention relates to an LED arrangement board connected to a radiant heat aluminum plane to emit the heat of a PCB board in which LEDs are arranged. The present invention forms a cooling fin increasing the radiant heat surface area of the rear surface of the aluminum plane by forming an uneven part in an etching method. The cooling fin has a unit cell pattern for each LED installed on the PCB board on the rear surface of the radiant heat aluminum plane in the etching method, and the unit cell pattern is formed as a quadrangle in which a plurality of radiant heat fins are continuously formed at each side. Therefore, the plane cooling fin type LED arrangement board increases a radiant heat surface area of the aluminum plane by arranging the unit cell pattern in zigzag not to be touched with a radiant heat fin of a neighboring unit cell pattern. The present invention is provided to improve the radiant heat surface area of the radiant heat board attached to an LED board, thereby solving a radiant heat problem of the LED board. |
