| 摘要 |
A camera module is provided to process image conversion signals processed in an image sensor chip by using a multi layer board, thereby easily processing even mass image signals caused by usage of a high pixel image sensor. An image sensor chip(12) converts optical energy into an electric signal. A multi-layer board(11) is electrically connected with the image sensor chip mounted in an upper surface, and has plural circuit pattern layers within it. A lens unit(15) concentrates light into the image sensor chip. The multi layer board includes contact-hole terminals(112) formed along side length direction grooves in its upper surface. |
