发明名称 FABRICATION METHOD OF SEMICONDUCTOR APPARATUS
摘要 A method of fabricating a semiconductor apparatus includes forming an insulating layer on a semiconductor substrate, forming a source post in the insulating layer, and forming a semiconductor layer over the source post and the insulating layer.
申请公布号 US2014179069(A1) 申请公布日期 2014.06.26
申请号 US201313845770 申请日期 2013.03.18
申请人 SK HYNIX INC. 发明人 LEE Young Ho;BAEK Seung Beom
分类号 H01L29/66 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of fabricating a semiconductor apparatus, the method comprising: forming an insulating layer on a semiconductor substrate; forming a source post in the insulating layer; and forming a semiconductor layer directly over the source post and the insulating layer.
地址 Gyeonggi-do KR