| 主权项 |
1. A method of thinning an encapsulated component, comprising:
abrading a first area of a first surface of an encapsulated component to reduce a thickness of the encapsulated component within the first area, the encapsulated component including: a semiconductor chip having an active surface extending in a first direction and a second direction transverse to the first direction, the active surface facing in a direction opposite from that of the first surface, the semiconductor chip having a plurality of contacts at the active surface and a plurality of edges extending away from the active surface towards the first surface, and an encapsulant extending outwardly in the first and second directions from the edges of the semiconductor chip, an entire area of the active surface being aligned with the first area in the first and second directions, the abrading being performed such that after the abrading, a second area of the encapsulated component beyond the first area has a thickness greater than the reduced thickness, wherein the second area is configured to fully support the abraded encapsulated component in a state in which the encapsulated component is manipulated by handling equipment. |
