INTEGRATED CIRCUIT DEVICE WITH STITCHED INTERPOSER

摘要

Systems, methods, and devices are provided to enable an integrated circuit device of relatively higher capacity. Such an integrated circuit device may include at least two component integrated circuits that communicate with one another. Specifically, the component integrated circuits may communicate through a “stitched silicon interposer” that is larger than a reticle limit of the lithography system used to manufacture the interposer. To achieve this larger size, the stitched silicon interposer may be composed of at least two component interposers, each sized within the reticle limit and each separated from one another by a die seal structure.

主权项

1. An integrated circuit device comprising:
first and second component integrated circuits configured to communicate with one another; and a contiguous interposer comprising chip-to-chip interconnects to facilitate communication between the first and second component integrated circuits, wherein the interposer is larger than a reticle limit of a lithography system used to manufacture the interposer.