发明名称 Method for Detecting Defects During a Laser-Machining Process and Laser-Machining Device
摘要 Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.
申请公布号 US2014175071(A1) 申请公布日期 2014.06.26
申请号 US201314140711 申请日期 2013.12.26
申请人 TRUMPF Laser - und Systemtechnik GmbH 发明人 Pfitzner Dieter;Braun Holger;Dorsch Friedhelm
分类号 B23K26/03;G06T7/00;B23K26/04 主分类号 B23K26/03
代理机构 代理人
主权项
地址 Ditzingen DE