| 摘要 |
<p>A dry etching method according to one embodiment of the present invention is a dry etching method for etching an object by irradiating a high-speed particle beam comprising sublimation particles, comprising: a high-speed particle beam generation step of generating the high-speed particle beam comprising the sublimation particles; and an etching step of etching the object by irradiating the high-speed particle beam that is generated on the object. Also, a dry etching apparatus according to one embodiment of the present invention is a dry etching apparatus for etching an object, comprising a nozzle for generating a high-speed particle beam that comprises sublimation particles, wherein the nozzle generates ultra-high speed uniform nanoparticles by passing therethrough a particle generation gas comprising carbon dioxide, and comprises an expanding portion having a shape so that the cross sectional area thereof becomes wider toward a discharge side of the nozzle, wherein the expanding portion sequentially comprises a first expanding portion and a second expanding portion, and wherein an average expansion angle of the second expanding portion is bigger than an expansion angle of the first expanding portion.</p> |
