| 摘要 |
The present invention relates to a cutting device. The cutting device, according to the present invention, comprises: an absorption unit which fixes a substrate by adsorbing and enables a linear reciprocating movement and a rotational movement; a cutting unit for cutting the substrate into individual units along a cutting path by being provided to enable up and down movement relative to the adsorption unit; a main pneumatic unit for providing air pressure to the adsorption unit to adsorb the substrate when a normal power supply is provided; a secondary pneumatic unit for providing air pressure to the adsorption unit when the power supply is abnormally terminated and a substrate is provided to the adsorption unit; and a recognition storage unit for recognizing a position of the cutting unit on the cutting path in real-time to store the position information and the cutting path. |
