| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable multilayer wiring board that can be manufactured by a simple process.SOLUTION: A multilayer wiring board 1 includes a plurality of multilayer wiring parts 2, 3 where a plurality of printed wiring boards 10, 20, obtained by forming the wiring layers 12, 22 on flexible insulating base materials 11, 21, are laminated with an adhesive layer 9 interposed therebetween, and the wiring layers 12, 22 are interconnected through vias 6 penetrating in the lamination direction, and a flexible cable 4 connecting the plurality of multilayer wiring parts 2, 3. The cable 4 is formed by laminating the insulating base material 11 and the wiring layer 12, corresponding to at least one layer of the printed wiring board 10 led out from the plurality of multilayer wiring parts 2, 3, and the insulating base material 21 of a printed wiring board 20 of upper layer with the adhesive layer 9 interposed therebetween.</p> |
