发明名称 |
PROJECTION EXPOSURE APPARATUS WITH OPTIMIZED ADJUSTMENT POSSIBILITY |
摘要 |
A projection exposure apparatus for microlithography includes: an illumination system configured to illuminate a mask in an object field with exposure light; and a projection objective comprising multiple optical elements configured to image the exposure light from the mask in the object field to a wafer in an image field. The projection exposure apparatus is a wafer scanner configured to move the wafer relative to the mask during an exposure of the wafer with the exposure light. The projection objective further includes at least one manipulator configured to manipulate at least one of the optical elements and a control unit configured to control the manipulator. The control unit is configured to manipulate the optical element with the manipulator during the exposure of the wafer with the exposure light. |
申请公布号 |
US2014176924(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201414195001 |
申请日期 |
2014.03.03 |
申请人 |
Carl Zeiss SMT GmbH |
发明人 |
Bittner Boris;Walter Holger;Roesch Matthias |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A projection exposure apparatus for microlithography comprising:
an illumination system configured to illuminate a mask in an object field with exposure light; and a projection objective comprising multiple optical elements configured to image the exposure light from the mask in the object field to a wafer in an image field, wherein the projection exposure apparatus is a wafer scanner configured to move the wafer relative to the mask during an exposure of the wafer with the exposure light, and wherein the projection objective further comprises at least one manipulator configured to manipulate at least one of the optical elements and a control unit configured to control the manipulator, and the control unit is configured to manipulate the optical element with the manipulator during the exposure of the wafer with the exposure light. |
地址 |
Oberkochen DE |