发明名称 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor device having stable characteristics in a long term.SOLUTION: A gate insulating film 21 is formed on a silicon carbide substrate 10. A gate electrode 30 is formed on the gate insulating film 21. A main electrode 31 is formed on the silicon carbide substrate 10. The silicon carbide substrate 10 is cleaned by using liquid containing water after formation of the gate insulating film 21. The silicon carbide substrate 10 is subjected to heat treatment in an atmosphere containing hydrogen atoms after cleaning the silicon carbide substrate 10.
申请公布号 JP2014116350(A) 申请公布日期 2014.06.26
申请号 JP20120267196 申请日期 2012.12.06
申请人 SUMITOMO ELECTRIC IND LTD;RENESAS ELECTRONICS CORP 发明人 SHIOMI HIROSHI;MURAKISHI TAKEO
分类号 H01L21/336;H01L21/28;H01L29/12;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/336
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