LED Lighting Apparatus with Facilitated Heat Transfer and Fluid Seal

摘要

LED lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink. The apparatus may use manipulation involving surface convexity, such as bowing, thereby allowing the securement structure to further facilitate surface-to-surface thermal coupling between the circuit board and the heat sink.

主权项

1. In lighting apparatus comprising (a) a circuit board having a plurality of solid-state light sources spaced thereon, the circuit board having a circuit-board middle area and a circuit-board peripheral area and a thermal-engagement surface opposite the light sources, (b) a heat sink forming a surface for receiving the circuit board, and (c) securement structure securing the circuit board to the heat sink, the improvement wherein the securement structure comprises a rigid peripheral structure applying force along the circuit-board peripheral area toward the heat sink to increase thermal contact the across the facing area of the circuit-board thermal-engagement surface and the heat-sink surface to facilitate removal of heat from the light sources during operation.