| 摘要 |
<p>If an external electrode for a multilayer ceramic electronic component is formed on a ceramic element by baking a conductive paste that contains a glass component, the glass component penetrates into the grain boundary among ceramic particles of the ceramic element. If a plating film is formed on the external electrode by wet plating, the glass component penetrated into the grain boundary is dissolved by the plating liquid, whereby the ceramic element becomes fragile in the vicinity of the edge of the external electrode. When an external electrode (32) is formed, a ceramic element (22), onto which a conductive paste is applied, is subjected to a heat treatment at a top temperature of 800°C or more with an electromotive force at the top temperature of 600-900 mV. During this heat treatment, the glass component in the conductive paste penetrates into the grain boundary (42) among ceramic particles (41) of the ceramic element (22), and a crystalline product containing the element that constitutes the glass component and having dissolution resistance to plating liquids is produced.</p> |
