| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaving device and a cleaving method capable of eliminating the need for adhering an adhesive sheet onto a plate-like member in advance.SOLUTION: A cleaving device 1 comprises: fragile part formation means 20 forming a fragile part to a wafer WF provided as a plate-like member; and vibration giving means 30 giving the wafer WF vibration that can break the fragile part. By breaking the fragile part by the vibration giving means 30, the wafer WF is cleaved in semiconductor chips of a plurality of small pieces. |
