| 摘要 |
PROBLEM TO BE SOLVED: To allow for thermal separation, without impairing continuity of a circuit pattern assuming a single substrate, by arranging a plurality of substrates separately in the vertical direction, thereby separating high heat-generating components and low heat-generating components to different substrates.SOLUTION: A first circuit pattern on which low heat-generating components, such as an electrolytic capacitor C14, excepting high heat-generating components in a power supply circuit, are arranged is formed on a first substrate 10, and a second substrate 12 is arranged to face the first substrate 10 separately therefrom. A second circuit pattern on which high heat-generating components, such as a switching element Q, are arranged separately from the first circuit pattern is formed on the second substrate 12. Connection pin members 18a-18m are arranged between the first substrate 10 and second substrate 12, and the second circuit pattern of the second substrate 12 on which high heat-generating components are arranged is connected electrically with the first circuit pattern of the first substrate 10 on which only the low heat-generating components are arranged. |
