| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding technique that improves the accuracy of positioning between objects to be bonded in the bonding, while applying surface activation treatment.SOLUTION: A bonding method includes the steps of: bringing the bonding surface between a first object to be bonded and a second object to be bonded into contact with each other; measuring the positional displacement between the objects to be bonded in the in-plane direction of the bonding surface in a contact state; moving the objects to be bonded in the in-plane direction of the bonding surface so as to separate the objects to be bonded and correct the positional displacement in the in-plane direction of the bonding surface, when the positional displacement measured in the contact state exceeds a tolerance range; repeating the above step until measured positional displacement becomes lower than the tolerance range; separating the bonding surface of the object to be bonded and applying the surface activation treatment to the bonding surface of the objects to be bonded; and bringing the bonding surface of the objects to be bonded into contact with each other. |
