| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame and a manufacturing method of the same, which increase adhesion between a pad part and a mold resin to increase reliability of a semiconductor device using the lead frame.SOLUTION: A manufacturing method of a lead frame 10 used for a semiconductor device including a pad part 12 having an area wider than that of a mounting semiconductor element 11 comprises: a process of forming a plurality of rows f grooves 16, 17 on a front side of the pad part 12 and other than a mounting region 15 of the semiconductor element 11 by first crushing; and a process of performing second crushing by depressing banks 27 on one side or both sides of each of the grooves 16, 17 by a pressure mold 29, thereby to form in the grooves 16, 17, a resin hooking part 24 such that sidewalls 20, 21 on the one side or both sides incline toward the center side of the grooves 16, 17, respectively, and a width of the resin hooking part 24 becomes smaller toward the front side. |
