发明名称 |
SEMICONDUCTOR PHOTONIC PACKAGE |
摘要 |
A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion. |
申请公布号 |
US2014177222(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201213721833 |
申请日期 |
2012.12.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Barwicz Tymon;Fortier Paul F.;Harel Stephane G.;Vlasov Yurii A. |
分类号 |
H01L33/48;F21V21/00 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Armonk NY US |