发明名称 Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metalurgical Bonds
摘要 An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
申请公布号 US2014177132(A1) 申请公布日期 2014.06.26
申请号 US201414193293 申请日期 2014.02.28
申请人 Kemet Electronics Corporation 发明人 MCCONNELL JOHN E.;RENNER GARRY L.;BULTITUDE JOHN
分类号 H01G4/008 主分类号 H01G4/008
代理机构 代理人
主权项 1. A method for forming a capacitor comprising: providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of said aluminum oxide dielectric; bonding an anode lead to said aluminum anode on a second portion of said aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding said aluminum anode to said anode lead; and bonding a cathode lead to said cathode.
地址 Simpsonville SC US