发明名称 |
Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metalurgical Bonds |
摘要 |
An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode. |
申请公布号 |
US2014177132(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201414193293 |
申请日期 |
2014.02.28 |
申请人 |
Kemet Electronics Corporation |
发明人 |
MCCONNELL JOHN E.;RENNER GARRY L.;BULTITUDE JOHN |
分类号 |
H01G4/008 |
主分类号 |
H01G4/008 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a capacitor comprising:
providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of said aluminum oxide dielectric; bonding an anode lead to said aluminum anode on a second portion of said aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding said aluminum anode to said anode lead; and bonding a cathode lead to said cathode. |
地址 |
Simpsonville SC US |