Apparatus and Method For High Voltage I/O Electro-Static Discharge Protection

摘要

An electronics chip includes a charge pump and at least one high voltage (HV) electro-static discharge (ESD) module. The charge pump is configured to provide a predetermined voltage across a microphone. The devices described herein are implemented in a standard low voltage CMOS process and has a circuit topology that provides an inherent ESD protection level (when it is powered down), which is higher than the operational (predetermined) DC level. At least one high voltage (HV) electro-static discharge (ESD) module is coupled to the output of the charge pump. The HV ESD module is configured to provide ESD protection for the charge pump and a microelectromechanical system (MEMS) microphone that is coupled to the chip. The at least one HV ESD module includes a plurality of PMOS or NMOS transistors having at least one high voltage NWELL/DNWELL region formed within selected ones of the PMOS or NMOS transistors. The at least one high voltage NWELL/DNWELL region has a breakdown voltage sufficient to allow a low voltage process to be used to construct the chip and still allow the HV ESD module to provide ESD protection for the chip.

主权项

1. An electronics chip, the chip comprising:
a charge pump, the charge pump configured to provide a predetermined voltage across a microphone, the charge pump being implemented in a low voltage CMOS process; at least one high voltage (HV) electro-static discharge (ESD) module coupled to the output of the charge pump, the HV ESD module configured to provide ESD protection for the charge pump and a microelectromechanical system (MEMS) microphone that is coupled to the chip; wherein the at least one HV ESD module includes a plurality of PMOS or NMOS transistors having at least one high voltage NWELL/DNWELL region formed within selected ones of the PMOS or NMOS transistors, the at least one high voltage NWELL/DNWELL region having a breakdown voltage sufficient to allow a low voltage process to be used to construct the chip and still allow the HV ESD module to provide ESD protection for the chip.