发明名称 BATTERY PROTECTION MODULE PACKAGE
摘要 The present invention relates to a battery protection module package. The battery protection module package according to an embodiment of the present invention includes: a lead frame where a plurality of external terminals are formed; a printed circuit board that is arranged to be laminated on the lead frame; a plurality of electrically connected internal terminals that are arranged on the printed circuit board; a protective IC; an FET; a resistor; and a capacitor. The resistor and the capacitor are mounted, by using surface mounting technology, on a pattern of the printed circuit board. The plurality of internal terminals are electrically connected to the plurality of external terminals.
申请公布号 WO2014098414(A1) 申请公布日期 2014.06.26
申请号 WO2013KR11562 申请日期 2013.12.13
申请人 ITM SEMICONDUCTOR CO.,LTD 发明人 NA, HYEOK HWI;HWANG, HO SUK;KIM, YOUNG SEOK;PARK, SUNG BEUM;AHN, SANG HOON;JUNG, TAE HWAN;PARK, SEUNG UK;PARK, JAE KU;CHO, HYUN MOK;PARK, MIN HO;YOON, YOUNG GEUN;JU, SEONG HO;JI, YOUNG NAM;MOON, MYOUNG KI;LEE, HYUN SUCK;PARK, JI YOUNG
分类号 H01M2/34;H01M2/20 主分类号 H01M2/34
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