发明名称 FILM FORMATION METHOD AND FILM FORMATION DEVICE
摘要 A film formation method is one for forming an organic layer comprising a fluorine-containing resin on an inorganic layer (3) formed on a substrate of interest and comprising an inorganic substance. In the method, for the formation of the inorganic layer, a reactive sputtering procedure using water vapor as a reactive gas is carried out to form the inorganic layer on the substrate of interest. Subsequently, the organic layer is formed on the inorganic layer. A film formation device enables the implementation of the film formation method.
申请公布号 WO2014097388(A1) 申请公布日期 2014.06.26
申请号 WO2012JP82774 申请日期 2012.12.18
申请人 ULVAC, INC. 发明人 YOSHIDA, TAKASHI;MATSUMOTO, MASAHIRO;TANI, NORIAKI;IKEDA, SUSUMU;KUBO, MASASHI
分类号 C23C14/06;C23C14/34 主分类号 C23C14/06
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