WHITE LED CHIP AND METHOD FOR MANUFACTURING SAME

摘要

A method for manufacturing a white LED chip, comprises: providing a substrate (100); forming a buffer layer (200) on the substrate; forming a semiconductor light-emitting structure on the buffer layer; forming a current diffusion layer (400) on the semiconductor light-emitting structure; forming a phosphor layer (500) on the current diffusion layer (400); forming a first electrode (601) in the phosphor layer (500); providing an introduced substrate (700); bonding the introduced substrate (700) with the phosphor layer (500) and the first electrode (601) under a first preset temperature and in an electric field; forming a second electrode (602) in the substrate (100); and removing the introduced substrate (700).